High Purity Aluminum titanium carbide Ti3AlC2 MAX Powder

Specification of High Purity Aluminum titanium carbide Ti3AlC2 MAX Powder:

CAS:196506-01-1

Product number:SAT-Ti3AlC2

Status: Grey Black powder

partilce size: 20um, 325mesh

Purity:99%

Characteristics: 

1.  312-type layered structure— alternating Ti₃C₂ and Al layers (P6₃/mmc); Al occupies 20 at% (~14.8 wt%), among the highest Al contents of the common MAX phases

2.  Density ~4.2 g/cm³— far lighter than Nb-based or Sn-based MAX phases

3.  Excellent electrical conductivity— on the order of 10⁶ S/m, approaching metals while retaining the oxidation resistance and thermal capability of a ceramic

4.  Machinable— Vickers hardness ~3–5 GPa, modulus ~290–300 GPa; can be turned, milled, drilled and tapped with carbide tooling — the most practical advantage of MAX phases
5.  Good fracture toughness— ~6–9 MPa·m^0.5, far above conventional structural ceramics; energy dissipation via layer sliding and kink-band formation
6. Good thermal stability— stable above 1400 °C in inert atmosphere; bulk material starts to oxidise noticeably in air at ~900–1000 °C, forming a mixed Al₂O₃ + TiO₂ scale that is less protective than Cr₂AlC but better than V₂AlC

Application of High Purity Aluminum titanium carbide Ti3AlC2 MAX Powder:

1. Ti₃C₂Tx MXene precursor (primary use)— the Al layers are selectively etched with HF or LiF + HCl; Ti₃C₂Tx is the most widely studied and most industrially mature MXene, and nearly all MXene application development starts here

2. Machinable conductive ceramic parts— electrodes, electrical contacts, heating elements, high-temperature bearings, nozzles and other complex shapes, processed like metal
3.  High-temperature structural and wear/self-lubricating components— dry-sliding parts, seal rings, high-temperature joints
4. Accident-tolerant fuel (ATF) cladding coating research— a candidate material for oxidation- and irradiation-resistant nuclear coatings

5. Composite reinforcement / conductive filler— metal-matrix and ceramic-matrix composites, plus conductive and EMI-shielding fillers

6. Sputtering targets and thin-film precursors— for depositing Ti₃AlC₂ or Ti₃C₂ films

7. Catalysts and catalyst supports— combining electrical conductivity with a layered structure

Other information

Storage conditions: Dry at room temperature, sealed in a dark place, protected by AR, with a maximum storage period of 3 months.