Conductive glue is composed of non-conductive resin and conductive filler. Since epoxy resin has excellent mechanical and thermal properties, low shrinkage, good bonding ability, resistance to mechanical and thermal shock, and strong resistance to humidity, solvents and chemical reagents, epoxy resin The resin system conductive adhesive is the most researched.
As the key material of conductive adhesive, conductive filler is also the main factor that determines the cost of conductive adhesive. Conductive fillers such as gold, silver, copper, etc. Gold has the most stable performance, but the highest cost. Copper is easily oxidized, which will cause its electrical conductivity to deteriorate. The procedure that silver powder is stable and has good electrical conductivity and becomes conductive adhesive filler.

Conductive silver powder is generally divided into flake silver powder, spherical silver powder and silver-coated copper powder. Here we mainly introduce the first two conductive silver powders.
At present, it is generally believed that the volume resistivity of the conductive adhesive using the same quality flake silver powder is smaller than that of the spherical silver powder. This is mainly because the contact of the spherical silver powder in the conductive adhesive is point-to-point contact, and the flake silver powder has a surface in addition to the point-to-point contact. Surface contact can reduce the contact resistance of the overall conductive adhesive. The current conductive adhesive filler flake silver powder is mainly prepared by ball milling, so there is a layer of organic matter on the surface of the flake silver, but if it cannot be removed after the conductive adhesive is cured, it will greatly affect the performance of the conductive adhesive. In the process of mechanical ball milling of fine silver powder, oleic acid is generally added, which can promote the dispersion of silver powder in the resin more uniformly, but at the same time, oleic acid is insulating, so the conductive performance of the conductive adhesive will decrease. Therefore, it is necessary for us to deal with silver powder.

Experiments have proved that after the silver powder is pickled, the insulating part of the surface is replaced, which can improve the conductivity of the silver powder. However, due to the removal of oleic acid, the compatibility of silver powder with epoxy resin system deteriorates. After the silver powder is treated with the coupling agent, the dispersion in the conductive adhesive is more uniform, and the conductivity is also significantly improved.

In addition, the blending of a small amount of spherical silver powder and flake silver powder improves the conductivity of the conductive adhesive. This is because the added small amount of silver powder fills the gaps between the flake silver powders, so that the original non-contact adjacent silver flakes are in contact with each other, increasing the conductive path, or forming more parallel conductive paths in the conductive glue.

SAT NANO has many years of experience in the development and production of silver powder series of professional and technical personnel to provide technical support for the enterprise. At the same time, the company has established close cooperative relations with many domestic and foreign universities and research institutions to ensure the sustainable development of the company. The company currently has an annual production capacity of 5 tons of flake silver powder.

Conductive flake silver powder and conductive spherical silver powder are of reliable quality, competitive price, and more favorable batches. SAT NANO is your first choice for cooperation. Welcome to call for consultation and purchase, or contact us online.