CAS 7440-05-3 Pd nanopowder Ultrafine Palladium as catalyst
Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
13929258449
Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
We can supply different size products of niobium silicide powder according to client's requirements. Size:1-3um; Purity:99.5%;Shape:granular CAS No:12034-80-9;ENINEC No.:234-812-3
Ni2Si particle,99.5% purity,granular shape,is used for Microelectronic integrated circuit, nickel silicide film,etc. Size:1-10um; CAS No:12059-14-2;ENINEC No.:235-033-1
Buy spherical alumina powder as thermally conductive filler, size 1-3um, 5um, 10um, 45um, 70um, 90um
Purity 99.6%, good quality, low price and fast delivery, please click it to check the specification.
Brand:
SAT NANOItem NO.:
OP12B08C-1UPayment:
TT, Paypal, WUProduct Origin:
ChinaColor:
White PowderShipping Port:
Shenzhen, ShanghaiLead Time:
1-5daysMin Order:
1kgProduct Performance
Spherical alumina as a thermally conductive filler can significantly increase the thermal conductivity of the mixture, reduce the expansion coefficient, and increase the strength of the mixture. The spherical shape is conducive to the dispersion and sliding of the powder in the system. It can be evenly dispersed in the organic body and form the closest packing to obtain a mixture with high filling, low viscosity and high thermal conductivity. Spherical alumina greatly reduces the wear of mixers, molding machines, molds and other equipment, which can extend the service life of equipment.
Specification of spherical alumina powder:
CAS No:1344-28-1 ENINEC No.:215-691-6
Appearance:white Powder
Particle size:1-3um, 5um, 10um, 45um, 70um, 90um
Purity:>=99.6%
Type:Spherical
Note: We can supply different size products of high purity alumina according to client's requirements.
Application of spherical alumina powder:
1. Thermally conductive gasket, thermally conductive silicone grease, thermally conductive potting compound, filler for heat dissipation substrate, thermal phase change material, etc.;
2. Filler for semiconductor packaging resin;
3. Silicone heat dissipation adhesive and filler for mixture;
4. Epoxy molding compound, epoxy castable filler, thermally conductive aluminum substrate, etc.
Storage conditions:
spherical alumina powder should be sealed and stored in a dry and cool environment. It should not be exposed to the air for a long time, to prevent agglomeration due to moisture, affecting the dispersion performance and use effect, and should avoid heavy pressure, do not contact with oxidant, and transport according to ordinary goods.