CAS 7440-05-3 Pd nanopowder Ultrafine Palladium as catalyst
Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
13929258449
Size:20-30nm Purity:99.95% CAS No:7440-05-3 ENINEC No.:231-115-6 Appearance:black Powder Shape:spherical
We can supply different size products of niobium silicide powder according to client's requirements. Size:1-3um; Purity:99.5%;Shape:granular CAS No:12034-80-9;ENINEC No.:234-812-3
Ni2Si particle,99.5% purity,granular shape,is used for Microelectronic integrated circuit, nickel silicide film,etc. Size:1-10um; CAS No:12059-14-2;ENINEC No.:235-033-1
Buy Ultrafine AlN Nano Aluminum Nitride powder used for high thermal conductivity, Size:50nm, 100nm, 1-3um, 5um, 10um, Purity:99.5%, high quality, low price and fast delivery, please click to check the specification.
Brand:
SAT NANOItem NO.:
NP1307-100NPayment:
TT, Paypal, WUProduct Origin:
ChinaColor:
Grey white PowderShipping Port:
Shenzhen, ShanghaiLead Time:
1-5daysMin Order:
100gSpecification of Ultrafine Aluminum Nitride:
CAS No:24304-00-5
ENINEC No.:246-140-8
Appearance:grey white Powder
Shape:Hexagonal&irregula crystal
Size:50nm, 100nm, 1-3um, 5um, 10um, Purity:99.5%
Note: We can supply different size products of AlN powder according to client's requirements.
Aluminum nitride is a new type of ceramic material with excellent comprehensive properties. It has good thermal conductivity, a series of excellent characteristics, reliable electrical insulation, low dielectric constant and dielectric loss, and matches with non-toxic silicon Thermal expansion coefficient.
Nano aluminum nitride has high purity, small particle size distribution, surface area, low high surface activity, bulk density and good injection molding performance. It can be used in manufacturing devices to lower the sintering temperature to improve dimensional stability, high hardness components, high elastic modulus, high dielectric constant and low dielectric loss, good thermal conductivity, oxidation resistance and low dielectric constant . Coefficient of thermal expansion (similar to silicon). For composite materials, it has good matching and interface compatibility with semiconductor silicon, and can improve the mechanical properties and thermal conductivity of composite materials.
Application of Ultrafine Aluminum Nitride:
nano aluminum nitride is mainly used to manufacture integrated circuit substrates, electronic components, optical devices, radiators, hot crucibles; the manufacture of metal-based and polymer-based composite materials, especially in high-temperature sealing and bonding It has excellent prospects for compatible electronic packaging materials. Nano aluminum nitride is also used for non-ferrous metal smelting and semiconductor materials gallium arsenide crucibles, evaporation boat protection tubes, thermocouples, high temperature insulation, microwave dielectric materials, high temperature and corrosion resistant aluminum nitride structural ceramics and transparent microwave ceramics, And the current application in PI resin, mica thermal insulation, thermal grease, insulating coating and thermal oil.